Build
The box was 3D printed, sanded, and assembled. The PCB was designed in KiCad and milled and printed by course instructors. The first version had an oversized layout, incorrect socket footprint labels, and a missing ground fill, requiring a full redesign and re-mill. The second version was more compact and correctly labeled, and functioned as intended after minor corrections including manually bridging a ground trace to the copper fill. Components were soldered onto the board, and the enclosure was printed, sanded, and assembled with all hardware.